To provide a heat treatment device capable of executing proper drying treatment with high efficiency.

A furnace body 31 of the heat treatment device 100 is provided with a drying zone Z2 and a burning zone Z3, and a first heating means 133 is disposed on a lower position with respect to a setter 110 in the drying zone Z2. As the setter 110 is heated only from the lower part in the drying zone Z2, even when the setter 110 provided with a lift pin insertion hole 111 is applied for performing loading of a substrate 1 and the like at a high speed, temperature difference between a hole portion opposite to the lift pin insertion hole 111 of the substrate 1 and a hole-free portion not opposite thereto can be reduced in comparison with a constitution performing heating only from an upper part, and irregularity in drying on a structure formation layer formed on the hole portion can be suppressed. As the drying treatment and the burning treatment are performed in one furnace body 131, the proper drying treatment can be performed with high efficiency.