Title:
HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS
Document Type and Number:
Japanese Patent JP2019001111
Kind Code:
A
Abstract:
To provide a heat treatment apparatus capable of uniformly heating a heat-treated member in a short time and capable of uniformly cooling the heat-treated member in a short time while being energy saving.SOLUTION: A heat treatment apparatus 1 includes: a pressure vessel 2; a placement table 3; direct heaters 4A and 4B for directly heating a heat-treated member; auxiliary heaters 4C and 4D; an inner wall cooler 5X; a placement table cooler 5Y; a plurality of target temperature sensors for measuring the temperature of the heat-treated material; an inner space temperature sensor 33; and a controller 8 for heating so that the inner space temperature of the pressure vessel 2 is a temperature lower than a target temperature to be a heating target of the heat-treated member, and controlling the direct heaters 4A and 4B, the auxiliary heaters 4C and 4D, the inner wall cooler 5X, the placement table cooler 5Y, and a mold cooler so that the temperature detected by the plurality of target temperature sensors is a target temperature.SELECTED DRAWING: Figure 1
Inventors:
TADA AKIRA
MATSUMINE TAKUO
MATSUMINE TAKUO
Application Number:
JP2017119166A
Publication Date:
January 10, 2019
Filing Date:
June 16, 2017
Export Citation:
Assignee:
HANYUDA TEKKOSHO KK
International Classes:
B29C43/52; B29C43/12; F27B17/00
Domestic Patent References:
| JPS63251207A | 1988-10-18 | |||
| JP2006334831A | 2006-12-14 | |||
| JP2005121308A | 2005-05-12 | |||
| JPS61230916A | 1986-10-15 | |||
| JPS62187017A | 1987-08-15 |
Attorney, Agent or Firm:
Minoru Nakayama