Title:
HEAT TREATMENT OF SUBSTRATE
Document Type and Number:
Japanese Patent JP3441469
Kind Code:
B2
Abstract:
PURPOSE: To prevent the thermal warpage and deformation of a substrate from being cumulated in the case where a vertical type heat-treating device is used.
CONSTITUTION: In the case where a vertical type heat-treating device is used, a boat with a substrate or a wafer 1 held horizontally by posts 2 at a prescribed pitch thereon is inserted in the interior of a reaction tube. In this state, heat- treat operations is normally performed more than one time. At this time, the heat-treat operation is performed at least one time in the attitude turned in the plane direction of the wafer 1 installed on the boat and the thermal warpage and deformation of the wafer are prevented from being cumulated.
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Inventors:
Kikuo Kaise
Takuo Sato
Takuo Sato
Application Number:
JP11409792A
Publication Date:
September 02, 2003
Filing Date:
April 07, 1992
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/336; G02F1/1333; H01L21/205; H01L21/22; H01L21/324; H01L29/78; H01L29/786; (IPC1-7): H01L21/22; G02F1/1333; H01L21/205; H01L21/324; H01L21/336; H01L29/786
Domestic Patent References:
| JP53101976A | ||||
| JP4120723A |
Attorney, Agent or Firm:
Harutoshi Suzuki
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