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Title:
熱処理基板
Document Type and Number:
Japanese Patent JP4689010
Kind Code:
B2
Abstract:
Apparatus and methods of thermally processing a substrate inside a processing chamber having a radiation source for heating the substrate are described. In one aspect, a detection system is configured to receive radiation from the substrate and to produce first and second detection system signals respectively representative of different first and second spectral portions of the received radiation. A processor is coupled to the detection system and configured to compute a measure of substrate temperature based upon the second detection system signal and to compute an indication of the relative accuracy of the computed measure of substrate temperature based upon the first detection system signal. In another aspect, the substrate is radiatively heated; radiation is received from the substrate and an intensity signal representative of the intensity of the received radiation is produced; an indication of the rate at which the substrate is being heated is computed based upon the intensity signal; and when the substrate is placed onto a substrate support inside the processing chamber is controlled based upon the computed heating rate indication.

Inventors:
Aeron hunter
Mark yam
Abhilash Jay Mayur
Application Number:
JP2000205287A
Publication Date:
May 25, 2011
Filing Date:
July 06, 2000
Export Citation:
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Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
G01J5/00; G01J5/02; F27D19/00; F27D21/00; G01J5/08; G01J5/10; H01L21/00; H01L21/205; H01L21/324; H01L21/66
Domestic Patent References:
JPH0599751A1993-04-23
JPH0493730A1992-03-26
JPH06201474A1994-07-19
Foreign References:
US5727017
Attorney, Agent or Firm:
Sonoda Yoshitaka
Kobayashi Yoshinori
Yoshiki Hasegawa
Yuichi Yamada