Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT TREATMENT SYSTEM AND HEAT TREATMENT METHOD
Document Type and Number:
Japanese Patent JP2002252220
Kind Code:
A
Abstract:

To properly perform heat treatment without the heat treatment affected by change with time and change in outside environment.

Each of heaters is independently powered, and the temperature of objects to be treated in a zone defined by each heater is controlled so as to correspond to a set point previously programmed, for film forming to be performed. When the film forming is finished, the set point for each zone is updated according to an equation 1: a new set point for each zone = the former set point for the same zone - [a thickness of a film formed in the same zone -an average thickness of films formed in the all zones] × the difference between the latest set point and the former set point/the difference between the thickness of film in the latest film forming and the thickness of film in the former film forming].


Inventors:
SAKAMOTO KOICHI
O BUNRYO
PARK YOUNG-CHUL
SUZUKI FUJIO
TAKENAGA YUICHI
OBARA ASAKI
ITO NAOHIDE
Application Number:
JP2001316638A
Publication Date:
September 06, 2002
Filing Date:
October 15, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKYO ELECTRON LTD
International Classes:
B01J19/00; F27B5/18; F27D19/00; G05D23/30; H01L21/31; (IPC1-7): H01L21/31; B01J19/00; G05D23/30
Attorney, Agent or Firm:
Kimura Mitsuru