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Patent Searching and Data


Title:
HEAT TREATMENT SYSTEM
Document Type and Number:
Japanese Patent JP2002043238
Kind Code:
A
Abstract:

To provide a heat treatment system for evenly heat treating among a plurality of wafers.

The heat treatment system 1 comprises a wafer boat 4 for horizontally holding a plurality of wafers and a heater in which the wafer boat 4 is arranged. The heater 3 has a plurality of main heaters 13a to 13e vertically arranged and auxiliary heaters 14a to 14e and 15a to 15e arranged in an adjacent area of the main heater arranged side by side.


Inventors:
Higuchi, Mitsuaki
Application Number:
JP2000000229449
Publication Date:
February 08, 2002
Filing Date:
July 28, 2000
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
H05B3/66; F27B5/14; F27D11/02; H01L21/205; H01L21/22; (IPC1-7): H01L21/22; F27B5/14; F27D11/02; H01L21/205; H05B3/66
Attorney, Agent or Firm:
上柳 雅誉 (外1名)