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Title:
THERMAL FLOW SENSOR
Document Type and Number:
Japanese Patent JP2017207280
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a high-accuracy thermal flow sensor in which a conductive member is arranged in a portion of a cover that constitutes a bypass passage structure, and with which, when producing the cover by insert molding while some face of the conductive member is exposed from cover resin, it is possible to suppress the movement or deformation of the conductive member during molding and reduce the generation of resin burrs in the exposed area of the conductive member.SOLUTION: A thermal flow meter of the present invention that solves the above problem is characterized in that a sub-passage for flowing gaseous matter to be measured that is taken in from a main passage is included, a flow detection element for detecting an air flow rate inside the sub-passage is arranged, and a cover for forming the sub-passage is included, the cover being formed by injection molding, a member having conductivity being arranged inside the cover while being partially exposed to the sub-passage side, and a cover molding gate being provided directly above an area where the conductive member is arranged.SELECTED DRAWING: Figure 4C

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Inventors:
DOI RYOSUKE
TASHIRO SHINOBU
UENODAN AKIRA
SAITO TOMOAKI
WATANABE TASUKU
Application Number:
JP2016097578A
Publication Date:
November 24, 2017
Filing Date:
May 16, 2016
Export Citation:
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Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD
International Classes:
G01F1/684
Domestic Patent References:
JP2017083316A2017-05-18
Foreign References:
US20130061684A12013-03-14
WO2017073271A12017-05-04
Attorney, Agent or Firm:
Yuji Toda



 
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