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Title:
HEATER BLOCK, PACKAGING APPARATUS INCLUDING THE SAME, AND PACKAGE
Document Type and Number:
Japanese Patent JP2002337819
Kind Code:
A
Abstract:

To provide a heater block which can easily form a tear-off portion on a packaging film without providing an anti-welding layer.

On a part of a contact surface 11A of the heater block 10 in contact with both overlapping ends 2W of the packaging film 2, a heat shielding body 12 for forming a heat shielding region is provided, which regulates heat conduction of a predetermined temperature or higher to the overlapping ends 2W from the heater block 10.


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Inventors:
ISHIZAKI EIJI
Application Number:
JP2001149670A
Publication Date:
November 27, 2002
Filing Date:
May 18, 2001
Export Citation:
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Assignee:
SONY CORP
International Classes:
B65D85/57; B65B11/28; B65B51/10; (IPC1-7): B65B51/10; B65D85/57
Domestic Patent References:
JPH11255211A1999-09-21
JP2000168736A2000-06-20
JPS5057877U1975-05-30
JPH03120409U1991-12-11
JPS63272617A1988-11-10
JPS62152977U1987-09-28
JPH10101130A1998-04-21
Attorney, Agent or Firm:
Yasuo Iisaka



 
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