HEATER CHIP FOR THERMAL BONDING AND METHOD FOR MANUFACTURING THE SAME

Title:

HEATER CHIP FOR THERMAL BONDING AND METHOD FOR MANUFACTURING THE SAME

Document Type and Number:

Japanese Patent JP2001284781

Kind Code:

A

Abstract:

To provide a heater chip for thermal bonding which can provide a stable highly-reliable temperature control.

A heater chip for thermal bonding 30 has a thermocouple 11 and a through hole 17 as retaining means for positioning two wires 11a, 11b of the thermocouple 11 near the bonding tip end 3 of a resistance heating portion 2. The wires 11a, 11b of the thermocouple 11 are passed through the through hole 17 and their junction 12 is welded to a heater chip 10 at the opening of the through hole. The position of the junction 12 is fixed for any heater chip 30, which can provide a uniformly extremely fine temperature control. Further, since the wires 11a, 11b are held in the through hole 17, they are hard to be broken even if they receive twisting stress and bending stress.

Inventors:

AMADA YOSHIHIRO
AOKI HIDENORI
SHIBA NOBUYASU

Application Number:

JP2000094311A

Publication Date:

October 12, 2001

Filing Date:

March 30, 2000

Export Citation:

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Assignee:

TAIYO YUDEN KK

International Classes:

H05K3/32; B23K11/30; B23K20/00; B23K28/02; H01L21/60; H01L21/603; H01L23/34; H05K3/34; (IPC1-7): H05K3/32; H01L21/60

Attorney, Agent or Firm:

Watari Wataru

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