Title:
ヒータ装置
Document Type and Number:
Japanese Patent JP6794861
Kind Code:
B2
Abstract:
A heater device for warming a user has a heater panel including a planar heating element which generates heat by energization, a first heat radiation surface formed on one surface side of the heating element, and a second heat radiation surface formed on the other surface side of the heating element. The temperature of the first heat radiation surface is higher than the temperature of the second heat radiation surface. In the heater panel, the first heat radiation surface is configured as a non-contact heater that warms the user in a non-contact manner, and the second heat radiation surface is configured as a contact heater that warms the user in a contact manner.
Inventors:
Yusuke Tanaka
Ishikawa
Hiroyasu Birth
Hideki Seki
Ishikawa
Hiroyasu Birth
Hideki Seki
Application Number:
JP2017021457A
Publication Date:
December 02, 2020
Filing Date:
February 08, 2017
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H05B3/20; A47C7/74; B60H1/00; B60H1/22; B60N2/56
Domestic Patent References:
| JP9329341A | ||||
| JP6051918U | ||||
| JP2011246093A | ||||
| JP2013241040A |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office