Title:
HEATER FOR THIN FILM VAPOR DEPOSITION
Document Type and Number:
Japanese Patent JP2007182622
Kind Code:
A
Abstract:
To provide a heater for thin film vapor deposition whose manufacture is facilitated, and which stably acts.
The heater for thin film vapor deposition is equipped with: a wafer supporting plate in which a wafer is mounted, a heat generation member is built-in, and a plurality of injection holes are formed at the edge side; a shaft arranged at the lower side of the wafer supporting plate, and in which an inert gas passage for feeding inert gas is formed; and a flow passage forming cover coupled to the lower part of the wafer supporting plate, and forming an internal space in a gap with the wafer supporting plate, and the internal space couples the injection holes and the inert gas passage.
Inventors:
BAIK CHOON KUM
LEE KI HOON
CHOI HYUNG SUB
SEO KANG JIN
LEE KI HOON
CHOI HYUNG SUB
SEO KANG JIN
Application Number:
JP2006254555A
Publication Date:
July 19, 2007
Filing Date:
September 20, 2006
Export Citation:
Assignee:
IPS LTD
International Classes:
C23C14/50; C23C16/458; C23C16/46; H01L21/205; H01L21/285; H01L21/683
Foreign References:
US20030136520A1 | 2003-07-24 |
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda
Makoto Onda
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