To solve a problem where necessary thermal uniformity and temperature responsiveness can not be provided due to temperature dispersion of a wafer heating device.

According to this application, one-side principal surface of a plate-like body is used as a heating surface for heating a heating object; a strip-like resistance heating element is installed in its inside or on the other principal surface; the strip of the strip-like resistance heating element is arranged in a nearly concentric circular ring-like form by continuing arcuate wire parts and folded-back arcuate wire parts having generally the same width; the distance between a pair of the folded-back arcuate wire parts positioned on the same circumference is set smaller than the distance between circular arc-like patterns adjacent to each other in the radial direction; power feed parts are formed at both ends of the resistance heating element; and the power feed parts are located outside the circular ring.