HEATING CONDITION SETTER FOR HEATING FURNACE AND THERMAL ANALYZER FOR ARTICLE TO BE HEATED IN HEATING FURNACE

Japanese Patent JP3274095

B2

PROBLEM TO BE SOLVED: To minimize thermal damage onto small electronic parts mounted on a printed wiring board by grasping the relation between variation in the heating conditions of each heat source and temperature variation at each detecting point of an article to be heated and then setting heating conditions for bringing each detecting pint to a target temperature uniquely.
SOLUTION: Inside of the tunnel-like body 1 of a reflow furnace is divided into four zones, for example, and each zone is provided with a heating source comprising far infrared heaters 4, 7, a near infrared heater 5 and a hot air fan heater 6. At the time of reflow soldering of a printed wiring board 2, it is heated during a process for carrying the board 2 on a conveyor 3 from an inlet A toward an outlet B. In order to prevent thermal damage due to abrupt heating, the board 2 is preheated and then heated uniformly. More specifically, variation in the heating conditions of each heating source and temperature variation at each detecting point of the board 2 are calculated thus setting heating conditions for bringing each detecting pint to a target temperature.

Hiroki Uchida
Masaki Sakuyama

JP11942398A

April 15, 2002

April 28, 1998

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富士通株式会社

B23K1/00; B23K1/008; B23K3/04; B23K31/02; F27B9/06; F27B9/36; F27B9/40; G05D23/19; H05K3/34; (IPC1-7): F27B9/06; B23K1/00; B23K1/008; B23K3/04; B23K31/02; F27B9/36; F27B9/40; H05K3/34

JP350790A
JP4162961A
JP8222847A
JP415087B2
JP677830B2
JP692027B2

Shintaro Nogawa

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