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Title:
HEATING AND COOLING METHOD FOR MANUFACTURING PHOTOMASK, AND HEATING AND COOLING SYSTEM TO REALIZE METHOD
Document Type and Number:
Japanese Patent JP2006323297
Kind Code:
A
Abstract:

To improve temperature uniformity on a mask substrate in heating and cooling in relation to a heating and cooling method for manufacturing a photomask and a heating and cooling system, in which the mask substrate is heated and cooled after predetermined treatment in the manufacture of the photomask.

The method is constructed as follows: after a lapse of a predetermined time period since start of heating of the mask substrate with a heating unit, a periphery of the mask substrate is covered with a frame portion, and simultaneously a thermo-reflection member is positioned on the upper side of the mask substrate and baking is conducted (S5-S8); and after a lapse of a predetermined time period since start of cooling of the mask substrate, on which the frame portion etc. have been arranged and are still remaining after completion of the baking, with a cooling unit, the frame portion etc. are detached from the mask substrate, and the cooling is continued (S25-S28).


Inventors:
HOSHINO TOSHIHIRO
Application Number:
JP2005148488A
Publication Date:
November 30, 2006
Filing Date:
May 20, 2005
Export Citation:
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Assignee:
MTC KK
International Classes:
G03F1/68; G03F1/76; G03F7/207; H01L21/027
Domestic Patent References:
JP2004303998A2004-10-28
JP2000323370A2000-11-24
JP2001077020A2001-03-23
JP2005033178A2005-02-03
JP2004146450A2004-05-20
JP2000323375A2000-11-24
JP2004319626A2004-11-11
Attorney, Agent or Firm:
▲高▼橋 寛