To provide a heating device which is comparatively small in size and capable of uniformly heating a heating object such as a circuit board on which an electronic component is loaded.
A heating furnace body 4 comprises a separable upper heating furnace 2 and a lower heating furnace 3. The circuit board having the electronic component loaded thereon is horizontally accommodated in the upper heating furnace 2, the upper face of the lower heating furnace 3 is made to closely contact with the under face side of the upper heating furnace 2, and hot air is blown from each of an upper air conduit 5 and a lower part air conduit 6 to both faces of the circuit board. The hot air flowing along both faces of the circuit board is discharged from a slit 9. Thereby, the circuit board is preheated, and thereafter, in a state of the lower heating furnace 3 being opened, while heating the circuit board by blowing hot air on the upper face of the circuit board in the heating furnace 2, the soldering of the lower face side of the circuit board is performed.
FUKUDA MASAYA
TAMURA TAKANORI
