Title:
HEATING ELEMENT SUPPORT SUBSTRATE AND SUBSTRATE ASSEMBLY
Document Type and Number:
Japanese Patent JP2016018827
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heating element support substrate of high versatility that can be used for various heating elements, and to provide a substrate assembly including such a heating element support substrate.SOLUTION: A heating element support substrate 20 supports an induction device 1 as a heating element. The heating element support substrate 20 includes a heat receiving metal plate 8 coming into contact with the induction device 1 and receiving heat generated therefrom, a heat dissipation metal plate 4 arranged on the side of the heat receiving metal plate 8 opposite from the induction device 1, and dissipating heat received by the heat receiving metal plate 8, and a bonding material 5 interposed between by the heat receiving metal plate 8 and the heat dissipation metal plate 4, and bonding these metal plates. The bonding material 5 is mainly composed of a hardened or solidified resin composition for bonding material mainly containing a resin material and a filler.SELECTED DRAWING: Figure 1
Inventors:
OKASAKA SHU
KOMIYATANI TOSHIO
KOIZUMI KOJI
BABA TAKAYUKI
KOMIYATANI TOSHIO
KOIZUMI KOJI
BABA TAKAYUKI
Application Number:
JP2014139173A
Publication Date:
February 01, 2016
Filing Date:
July 04, 2014
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
H01F27/22; H01F27/28; H01F27/32; H01F37/00; H05K7/20
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi
Kazuo Asahi