PURPOSE: To uniformize a temperature distribution on printed wiring by mounting electronic circuit parts on a printed wiring board on which paste is applied and arranging a temperature regulation mask to regulate the quantity of radiation with the size of small holes between said wiring board and heating equipment such as infrared rays.
CONSTITUTION: The printed wiring board 8 is fixed by a mask holder 13 and mounted on the temperature regulation mask 11 on which a gap is provided by a spacer 12. The mask holder 13 is transferred in the heating equipment by a belt conveyer 6 and during this time, the printed wiring plate 8 is heated by an infrared heater 5 via the temperature regulation mask 11. The quantity of radiation of the infrared rays is regulated according to the thermal capacity, etc., of the electronic circuit parts by the size of the small holes of the temperature regulation mask 11 and the variation of the distance of the spacer 12 and the presence or absence of a projecting part 15. Even if the mounting parts, a mounting pattern, etc., are changed by the change of kinds of machines, it can be dealt with the changed only by changing a constituent pattern of the temperature regulation mask without changing the temperature setting of the heating equipment and the mixed production can be carried out.
IWAMOTO ATSUNOBU
KIMURA NOBUO
OKADA YOSHIFUMI
JPS6181697A | 1986-04-25 | |||
JPS5010208A | 1975-02-01 | |||
JP54134745B |