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Title:
HEATING HEAD, SOLDER DEVICE USING HEATING HEAD, AND SOLDER METHOD
Document Type and Number:
Japanese Patent JP2014120649
Kind Code:
A
Abstract:

To provide a heating head which achieves high workability and high energy efficiency and enables a component having a large heat capacity to be preferably mounted on a substrate, and to provide a solder device and a solder method.

A heating head 1h comprises: a circuit shaped magnetically permeable member 2 which is made of a soft magnetic material, the magnetically permeable member 2 where a cleavage part 2a is provided at a part thereof; an induction heating coil 3 wound around the magnetically permeable member 2; and a solder supply device 4 for supplying solder to the cleavage part 2a of the magnetically permeable member 2. The above object is achieved by the heating head 1h, a solder device using the heating head 1h, and a solder method.


Inventors:
NISHIO SUMI
TAKAHASHI YUICHI
AMAIKE MASAHITO
Application Number:
JP2012275579A
Publication Date:
June 30, 2014
Filing Date:
December 18, 2012
Export Citation:
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Assignee:
ALONICS LTD
International Classes:
H05K3/34; B23K1/002; B23K3/00; B23K3/06; B23K31/02; B23K101/42
Domestic Patent References:
JP2007242691A2007-09-20
JP2012143805A2012-08-02
JPH10178261A1998-06-30
JPH0825032A1996-01-30
JP2009021326A2009-01-29
JPH04354399A1992-12-08
Attorney, Agent or Firm:
Kenji Itami
Tomohisa Higuchi