Title:
HEATING LED LAMP AND WAFER HEATING UNIT PROVIDED WITH THE SAME
Document Type and Number:
Japanese Patent JP2020009927
Kind Code:
A
Abstract:
To provide a heating LED lamp that can uniformly and quickly raise a wafer to a required temperature in a short time.SOLUTION: A heating LED lamp 100 includes a substrate 110 and a plurality of LEDs 120 mounted on the surface of the substrate 110. A pair of electrodes 112 are formed on the surface of one end of the substrate, and the LEDs are connected in series between these electrodes. In order to burn-in a wafer using the heating LED lamp, a plurality of heating LED lamps are arranged in a box-shaped heating furnace body, and a control device supplies an optimal amount of heat to the wafer placed on a wafer table.SELECTED DRAWING: Figure 1
Inventors:
GODA TETSUYA
Application Number:
JP2018130305A
Publication Date:
January 16, 2020
Filing Date:
July 09, 2018
Export Citation:
Assignee:
PHOENIX ELECTRIC CO LTD
International Classes:
H01L21/02; F27D11/00; H01L21/683; H01L33/48
Domestic Patent References:
| JP2011187752A | 2011-09-22 | |||
| JP2014003050A | 2014-01-09 | |||
| JP2012199470A | 2012-10-18 |
Attorney, Agent or Firm:
Yuji Tada