Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEATING METHOD OF ELECTRONIC COMPONENT, AND HEATING DEVICE OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2013245920
Kind Code:
A
Abstract:

To provide a heating method of an electronic component and a heating device of the electronic component, capable of more uniformly supplying a gas to the electronic component.

A sidewall 31 of a cylindrical setter 3A receiving an electronic component, has air permeability, and the cylindrical setter 3A is rotated in a state that the sidewall 31 faces downward, to supply a gas to the cylindrical setter 3A from a lower section of the sidewall 31 through the sidewall 31. By applying this configuration, the gas can enter into the cylindrical setter 3A from the whole periphery of the sidewall 31 in accompany with the rotation of the cylindrical setter 3A.


Inventors:
Ito, Yasuya
Watanabe, Hideaki
Kamiya, Sohiro
Goto, Daisuke
Application Number:
JP2012000122149
Publication Date:
December 09, 2013
Filing Date:
May 29, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TDK CORP
International Classes:
F27D3/12; F27B17/00
Attorney, Agent or Firm:
長谷川 芳樹
黒木 義樹
三上 敬史
石坂 泰紀



 
Previous Patent: STORAGE TYPE WATER HEATER

Next Patent: EXPANSION VALVE