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Title:
HEATING METHOD FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2007225278
Kind Code:
A
Abstract:

To provide a heating method capable of reducing a heat capacity of a heated object such as a rail for supporting a hoop, and capable of heating or drying efficiently and precisely an electronic component element in a short time.

This method is a method for heating by a heater or the like provided with the at least one pair of wire-rod-like rails 5a-5c arranged along a direction same to a longitudinal direction of the hoop 1 on which the electronic component element 2 is mounted and which is transferred along a longitudinal direction thereof, and for supporting sliding-conveyably the hoop 1, and a pulley (support means) 9 for supporting both ends of the rails 5a-5c onto a base block 7 to arrange the rails 5a-5c on one plane, and allows the efficient heating in the short time.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
SHIMOMURA MOTOO
KANEKO ISAO
YAMAMOTO HAJIME
Application Number:
JP2007100238A
Publication Date:
September 06, 2007
Filing Date:
April 06, 2007
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
F27B9/20; F26B15/18; F27D3/12
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano



 
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