Title:
HEATING MODULE AND BONDING DEVICE
Document Type and Number:
Japanese Patent JP2015026862
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that recently in tendency of enlargement in a diameter of a wafer, it becomes difficult uniform heating over each entire surface of the wafers to be overlapped.SOLUTION: A heating module for heating a wafer includes: a stage portion having a placing surface for placing a work to be heated; and a plurality of heater plates disposed on a surface to be heated which is opposite to the placing surface of the stage portion. The plurality of heater plates are disposed so as to cover at least a region, corresponding to the placing surface and be separated so that adjacent sides are parallel to each other.
Inventors:
IZUMI SHIGETO
Application Number:
JP2014206488A
Publication Date:
February 05, 2015
Filing Date:
October 07, 2014
Export Citation:
Assignee:
NIKON CORP
International Classes:
H01L21/02; H05B3/68
Domestic Patent References:
| JPWO2008001626A1 | 2009-11-26 | |||
| JPH11354528A | 1999-12-24 | |||
| JPH11121598A | 1999-04-30 |
Attorney, Agent or Firm:
Ryuka international patent business corporation
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