Title:
HEATING STRUCTURE AND THERMAL SENSOR
Document Type and Number:
Japanese Patent JP3699703
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heating structure and a thermal sensor having high-reliability output characteristics.
SOLUTION: A tabular substrate in which an aperture is bored is formed, and a supporting film 4 is formed on the whole of the surface of the substrate 1. A heating resistor 6 of a specified pattern made of a platinum film is formed on the supporting film 4, and a protective film 5 is formed on the whole surface of the supporting film 4 so as to cover the heating resistor 6. By removing a part of the substrate 1 in such a way as to reach the supporting film 4 from the rear face side of the substrate 1, a cavity 2 is formed below the formation region of the heating resistor 6, and a heating structure 8A of a diaphragm section is formed. Each of the supporting film 4 and the protective film 5 is made of a silicon nitride film having a < 2.25 refractive index.
Inventors:
Motohisa Taguchi
Masahiro Kawai
Masahiro Kawai
Application Number:
JP2002322230A
Publication Date:
September 28, 2005
Filing Date:
November 06, 2002
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
G01F1/692; G01K1/16; (IPC1-7): G01F1/692
Domestic Patent References:
| JP11194043A | ||||
| JP11287687A | ||||
| JP7106296A | ||||
| JP60022341A |
Attorney, Agent or Firm:
Michiteru Soga
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order