Title:
HEATSINK AND ELECTRONIC COMPONENT MODULE
Document Type and Number:
Japanese Patent JP2022107932
Kind Code:
A
Abstract:
To achieve high heat dissipation, effectively dissipate heat, prevent an excessive temperature rise, and improve reliability with a simple configuration.SOLUTION: A heatsink includes a heat conductive plate and a resin coating 31 integrated with the heat conductive plate so as to cover at least a part of the surface of the heat conductive plate, the resin coating 31 includes a ventilating tube 34 through which a ventilating hole 33 passing through the heat conductive plate and the resin coating 31 passes, and at least a portion of the heat conducting plate is housed inside a cylinder wall 34a of the ventilating tube 34.SELECTED DRAWING: Figure 1
Inventors:
TSUMURAYA TETSUNORI
Application Number:
JP2021002642A
Publication Date:
July 25, 2022
Filing Date:
January 12, 2021
Export Citation:
Assignee:
MOLEX LLC
International Classes:
H01L23/467; H01L23/12; H05K7/20
Attorney, Agent or Firm:
Toshiaki Aoki
Kawai Makoto
Kawai Makoto