HEATSINK AND ELECTRONIC DEVICE PROVIDED WITH THE SAME

Title:

HEATSINK AND ELECTRONIC DEVICE PROVIDED WITH THE SAME

Document Type and Number:

Japanese Patent JP2005191207

Kind Code:

A

Abstract:

To provide a heatsink which assures higher heat radiating capability and can improve total cooling efficiency of a cooling device for cooling the coolant through circulation thereof, and also to provide an electronic device mounting the same heatsink.

The electronic device is provided with a heatsink comprising a bending pipe 21 for receiving the heat of a coolant by circulating the coolant and a plurality of fins 22 which are fixed on the external side surface of the bending pipe 21 for exchanging the heat of the bending pipe 21 with the air in the atmosphere. This heatsink is mainly characterized in that a projected portion 25 is formed and the internal diameter of the bending pipe 21 is increased or decreased in the axial direction of the bending pipe.

Inventors:

NARAKINO SHIGERU
NOJIMA MASAHARU

Application Number:

JP2003429466A

Publication Date:

July 14, 2005

Filing Date:

December 25, 2003

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC IND CO LTD

International Classes:

F25D9/00; F28F1/42; F28F13/08; H01L23/473; H05K7/20; (IPC1-7): H01L23/473; F25D9/00; F28F1/42; F28F13/08; H05K7/20

Attorney, Agent or Firm:

Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito

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