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Patent Searching and Data


Title:
HEATSINK
Document Type and Number:
Japanese Patent JPH10284653
Kind Code:
A
Abstract:

To improve a thermal matching performance by a method, wherein a thermally conductive matrix metal unit is provided at the central part of a surface to which a cooled component attached and a composite material unit is provided around the thermally conductive matrix metal unit and both the units are thermally connected to each other.

A thermally conductive matrix metal unit 20 of a heatsink 1 is positioned at the approximately central part of a surface part 10, and a composite material unit 30 is positioned so as to surround the thermally conductive matrix metal unit 20. A cooled component is thermally connected to that part. The material of the thermally conductive matrix metal unit 20 has a large thermal expansion coefficient. However, as the compound material unit 30 exists so as to surround the thermally conductive matrix metal unit 20, the thermally conductive matrix metal unit 20 is confined and, in particular, the thermal expansion in a direction parallel with the left side surface of the surface part 10 is suppressed. Thus, the thermall expansion of the thermally conductive matrix metal unit 20 is suppressed, so that the thermal matching between the cooled component and the heatsink can be improved, and superior characteristics can be maintained for long term use.


Inventors:
KIMURA NAOKI
NIEKAWA JUN
NINOMIYA JUNJI
Application Number:
JP9382897A
Publication Date:
October 23, 1998
Filing Date:
April 11, 1997
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C04B41/88; C22C47/00; C22C49/00; C22C49/06; H01L23/36; H01L23/373; (IPC1-7): H01L23/36; C22C1/09; H01L23/373