Title:
シリコンウェーハのヘリカル面取り加工方法
Document Type and Number:
Japanese Patent JP6939752
Kind Code:
B2
Abstract:
Provided is a method of chamfer machining a silicon wafer which makes it possible to increase the number of machining operations that can be performed using a chamfering wheel used for helical chamfer machining in the case of obtaining a small finished wafer taper angle. The method in which helical chamfer machining is performed so that the finished wafer taper angle θ of an edge portion in the one silicon wafer is within an allowable angle range of a target wafer taper angle θ0 includes a first truing step; a first chamfer machining step; a step of determining a groove bottom diameter ϕA of the fine grinding grindstone portion; a second truing step using a second truer taper angle α2; and a second chamfer machining step. The second truer taper angle α2 is made larger than the first truer taper angle α1.
Inventors:
Kentaro Ishida
Application Number:
JP2018216585A
Publication Date:
September 22, 2021
Filing Date:
November 19, 2018
Export Citation:
Assignee:
Sumco inc.
International Classes:
B24B9/00; B24B53/06; H01L21/304
Domestic Patent References:
| JP2007165712A | ||||
| JP2291126A |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Keisuke Kawahara
Toshio Fukui
Mitsutsugu Sugimura
Keisuke Kawahara
Toshio Fukui