HIGH CORROSION-RESISTANT R-FE-B BONDED MAGNET AND ITS MANUFACTURE

Title:

HIGH CORROSION-RESISTANT R-FE-B BONDED MAGNET AND ITS MANUFACTURE

Document Type and Number:

Japanese Patent JP3236814

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a manufacturing method which is optimal for forming a corrosion- resistant film on the surface of a porous R-Fe-B bond magnet with high bonding strength and high dimensional accuracy to prevent a plating solution, cleaning solution, etc., from penetrating into and being retained in the bond magnet.
SOLUTION: The surface of an R-Fe-B bond magnet is polished by dry barrel-polishing through the use of the mixture of an abrasive and a plant medium or the abrasive and a plant medium which is improved with inorganic powder as a medium, so that the pore sections of the magnet are filled with the abrasive, inorganic powder, and polishing dust in such a state that the abrasive, powder, and dust are fixed with the fat and oil components of the vegetable medium, and at the same time, the surface of the magnet is smoothed. Therefore, an electroplated layer having no pinhole can be formed, because high electrical conductivity can be given to the surface of the magnet through the formation of a Cu film on the surface by performing barrel-polishing on the surface of the magnet by using Cu, whose shape is not specified, i.e., Cu having a spherical shape, a massive shape, a needle-like (wire-like) shape, etc., of required dimensions by the use of a barrel-polishing device, so that finely ground Cu pieces are press fitted in the resin surface and sealed pore sections on the surface of the magnet and the surface of the magnet is coated with the fine Cu pieces.

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Inventors:

Koji Yoshimura
Takeshi Nishiuchi
Fumiaki Kikui
Takahiro Isozaki

Application Number:

JP4455998A

Publication Date:

December 10, 2001

Filing Date:

February 10, 1998

Export Citation:

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Assignee:

Sumitomo Special Metal Co., Ltd.

International Classes:

H01F1/08; C22C38/00; C23C28/02; H01F41/02; (IPC1-7): H01F1/08; C22C38/00; C23C28/02; H01F41/02

Domestic Patent References:

JP4276094A
JP5138525A

Attorney, Agent or Firm:

Shigenobu Ikejou (1 person outside)

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