PURPOSE: To enable a pattern which cannot be provided on a circuit substrate of an IC card to be formed on a multi-layer substrate loaded on the circuit substrate, by connecting electrodes provided on the circuit substrate with electrodes provided on the multi-layer substrate.
CONSTITUTION: Electrodes 10 provided on a circuit substrate 1 are connected with electrodes 12 provided on a multi-layer substrate 2, whereby the pattern of the circuit substrate 1 is connected to the pattern of the multi-layer substrate 2. In this manner, a pattern which cannot be provided on the circuit substrate 1 of an IC card can be formed on the multi-layer substrate 2 loaded on the circuit substrate 1. The multi-layer substrate 2 is made of ceramic, and the electrodes 12 are disposed in recessed parts 13 provided on the multi-layer substrate 2. As a slit 11 provided on the circuit substrate 1, a groove can be alternatively provided. If the multi-layer substrate 2 is rectangular, the slit is disposed approximately parallel and/or perpendicular to its long and short edges; if a circle, it is disposed approximately parallel to the tangential line of the circle; and if an ellipse, it is disposed approximately at right angles to the major axis of the ellipse. The slit absorbs the difference in length caused by the difference in thermal expansibility between the circuit substrate 1 and the multi-layer substrate 2, which is caused by the use of different materials.
YOSHIDA SHOZO
TAKAHATA MITSUO
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