To provide a high density polyethylene resin composition eliminating the occurrence of powdering and gum in a film forming process and providing a film having excellent scratch resistance and hardly scratching a material to be packaged.

The high density polyethylene resin composition for the film contains 100 pts.wt. high density polyethylene having 0.940-0.980 g/cm3 density, 0.01-10 g/10 min MFR (Melt Flow Rate) (190C 21.18 N) and Q value of 4-40 and 0.05-1 pt.wt. talc in which the sum of the volume of particles having 20 m particle diameter is 5% or less of the total volume of the total particles.