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Title:
HIGH DIELECTRIC CONSTANT B-STAGED RESIN COMPOSITION SHEET AND PRINTED WIRING BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2002265754
Kind Code:
A
Abstract:

To provide a high dielectric constant B-staged resin sheet and a printed wiring board using the same.

The high dielectric constant B-staged resin composition sheet can be obtained by using a resin composition obtained by incorporating 80-99 wt.% insulating inorganic filler having a dielectric constant at room temperature of ≥500 into an epoxy resin composition comprising (a) an epoxy resin which is liquid at room temperature and (b) a thermosetting catalyst as the essential components, 1-75 wt.% insulating inorganic filler used being a needle insulating inorganic filler, and the printed wiring board uses the resin composition sheet. Thus, a high dielectric constant resin sheet could be manufactured, and a high dielectric constant printed wiring board using this sheet and having excellent heat resistance, electrical properties after moisture absorption, adhesion to copper foils, strength, and the like, could be manufactured.


Inventors:
IKEGUCHI NOBUYUKI
Application Number:
JP2001000065824
Publication Date:
September 18, 2002
Filing Date:
March 09, 2001
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08J5/18; B32B27/38; C08K3/00; C08K5/315; C08K7/00; C08L63/00; C08L79/00; H05K1/03; H05K3/00; (IPC1-7): C08L63/00; B32B27/38; C08J5/18; C08K3/00; C08K5/315; C08K7/00; C08L79/00; H05K1/03; H05K3/00
Attorney, Agent or Firm:
Masaaki Kobayashi