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Title:
High-fever conduction board material
Document Type and Number:
Japanese Patent JP6108533
Kind Code:
B2
Inventors:
今西 輝光
佐藤 安彦
清水 昭之
小岩 龍臣
Application Number:
JP2013055993A
Publication Date:
April 05, 2017
Filing Date:
March 19, 2013
Export Citation:
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Assignee:
住友精密工業株式会社
International Classes:
C22C49/06; B22F3/14; C22C1/10; C22C47/14; C22C49/14; H01L23/373
Domestic Patent References:
JP2007247058A
JP2010236015A
JP2010236016A
JP2009013475A
JP2003204022A
JP2012057252A
Foreign References:
WO2010013383A1
Attorney, Agent or Firm:
柳舘 隆彦



 
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