HIGH FLEXIBLE COPPER FOIL WITH LOW ROUGHNESS AND, MANUFACTURING METHOD THEREFOR

Title:

HIGH FLEXIBLE COPPER FOIL WITH LOW ROUGHNESS AND, MANUFACTURING METHOD THEREFOR

Document Type and Number:

Japanese Patent JP2009185384

Kind Code:

A

Abstract:

To provide a novel method by which the flexibility of an electrolytic copper foil is improved.

An untreated copper foil is surface-treated to have 310 Hv Vickers hardness, flexibility factor (F) of 0.01, 1.0-3.5 m roughness Rz of coarse roughness, 0.5-2.5 m roughness Rz of bright surface, 0.1% carbon content, 0.05% sulfur content, 10-100% crystal orientation, 2 g/m2 weight deviation and 20-200 pieces/100 m2 nodule number.

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Inventors:

KIM SEUNG MIN
KIM SANG GYUM
KIM JEONG IK
CHOI SEUNG JUN
SHIN DONG HWAN
CHAE YOUNG UK

Application Number:

JP2009014475A

Publication Date:

August 20, 2009

Filing Date:

January 26, 2009

Export Citation:

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