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Title:
HIGH-FREQUENCY CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2012114696
Kind Code:
A
Abstract:

To provide a high-frequency circuit board capable of suppressing passage loss of a high-frequency transmission line, such as a microstrip line for transmitting a high-frequency signal, and achieving high productivity, as well as low noise from a low-noise amplifier, high saturation power of an amplifier for transmission and low phase noise from a voltage variable oscillator.

The high-frequency circuit board includes: a transmission line formed from a metal conductor on a surface of an insulator substrate and a solder layer formed from reflow solder on a surface of a transmission line.


Inventors:
MORI SHIGEHISA
IKEMATSU HIROSHI
KAWAKAMI KENJI
ONISHI HIDETOMO
Application Number:
JP2010262327A
Publication Date:
June 14, 2012
Filing Date:
November 25, 2010
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
MITSUBISHI DENKI TOKKI SYSTEM KK
International Classes:
H01P3/08; H01P3/00; H01P11/00; H05K1/02; H05K1/09; H05K3/34
Domestic Patent References:
JPS60185403A1985-09-20
JP2010059445A2010-03-18
JPH0685436A1994-03-25
JPH04368005A1992-12-21
JPH0555746A1993-03-05
JPH07326910A1995-12-12
JPH1197912A1999-04-09
JP2001057886A2001-03-06
JP2007221713A2007-08-30
Attorney, Agent or Firm:
Shogo Takahashi
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka