Title:
HIGH FREQUENCY CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3838906
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide a high frequency circuit board to transmit frequency signals of higher frequency band, by reducing the distance between a grounded coaxial conductor and a coaxial conductor, and preventing short-circuiting between an internal conductor layer and an internal grounded conductor layer.
SOLUTION: The circuit board is provided with a dielectric substrate 1, first and second coplaner lines at the upper and lower surfaces of the substrate 1, respectively, the internal conductor layer 4a of substantially circular shape, a coaxial conductor 4 that penetrates through the center of the internal conductor layer 4a, a plurality of internal grounding conductor layers 5a each having substantially circular shape, which are formed on the circumference centering the internal conductor layer 4a with substantially a given distance therebetween, and a plurality of grounded coaxial conductors 5 which, respectively, penetrate through the centers of the internal grounded conductor layers 5a. Each internal grounded conductor layer 5a is formed around each grounded coaxial conductor 5, so as to have a shape in which an annular conductor layer cuts a portion at the side of the coaxial conductor 4 along a radius R. The angle made by a line L between a center C1 of the coaxial conductor 4 and a center C2 of the grounded coaxial conductor 5 and the radius R is rendered to be 90 to 120° at the side of the conductor layer.
Inventors:
Kusano, Tamio
Application Number:
JP2001000362177
Publication Date:
August 11, 2006
Filing Date:
November 28, 2001
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01L23/12; H01L23/12; (IPC1-7): H01L23/12