Title:
高周波回路冷却装置
Document Type and Number:
Japanese Patent JP4126029
Kind Code:
B2
Abstract:
The high-frequency circuit cooling apparatus comprises a package container 14 for housing a high-frequency circuit, a tank 16 for storing a gas to be introduced into the package container 14, a cold head 12 for cooling the package container 14 and the tank 16, pipes 24, 26 connected to the tank 16, for supplying the gas into the tank 16, pipes 18, 22 detachably connected between the tank 16 and the package container 14, for introducing the gas in the tank 16 into the package container 14, and pipes 34, 36 detachably connected to the package container 14, for discharging the gas in the package container 14.
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Inventors:
Kazunori Yamanaka
Teru Nakanishi
Teru Nakanishi
Application Number:
JP2004149618A
Publication Date:
July 30, 2008
Filing Date:
May 19, 2004
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L39/04; H01P7/08; F25D19/00; F25D23/12; H01P1/203; H05K7/20
Domestic Patent References:
| JP8008623A | ||||
| JP2000307306A | ||||
| JP9036442A |
Attorney, Agent or Firm:
Yoshito Kitano
Haruhiko Mimura
Haruhiko Mimura