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Title:
HIGH-FREQUENCY CIRCUIT AND MODULE DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP2001168533
Kind Code:
A
Abstract:

To reduce an electromagnetic coupling between a distributed constant line and a power supply line for a smaller circuit, related to a high-frequency circuit which uses a distributed constant line of multilayer structure.

The electromagnetic field coupling between a power supply line 5 and a first layer distributed constant line 3 as well as a second layer distributed constant line 4 which comprise a required high-frequency characteristics in electromagnetic coupling is reduced by a through hole 8, to which the electric potential connecting ground patterns 6 and 7 are grounded. Thus, no electromagnetic coupling occurs even if the power supply line 5 is wired close to the first layer distributed constant line 3 and second layer distributed constant line 4, causing no degradation in required high-frequency characteristics of the distributed constant lines 3 and 4.


Inventors:
IKEDA KAZUHIKO
MATSUBARA NAOKI
Application Number:
JP34895599A
Publication Date:
June 22, 2001
Filing Date:
December 08, 1999
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K9/00; H05K1/02; H05K3/46; (IPC1-7): H05K3/46; H05K1/02; H05K9/00
Attorney, Agent or Firm:
Teruo Aoki