Title:
HIGH FREQUENCY COMPONENT AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2022105393
Kind Code:
A
Abstract:
To provide a high frequency component that can be manufactured with good mass productivity.SOLUTION: A high frequency component 10 includes a dielectric member 1 having a first main surface 1a and a first back surface 1b, and a dielectric substrate 2 having a second main surface 2a and a second back surface 2b. A housing recess 11 is formed on the second main surface 2a. At least a part of the dielectric member 1 is arranged in the housing recess 11 such that the first main surface 1a faces the bottom surface 11a of the housing recess 11. A first wiring layer 3 is formed between the bottom surface 11a and the first main surface 1a. A second wiring layer 4 is formed which extends from the first back surface 1b to the second main surface 2a and at least partially overlaps with the first wiring layer 3 in a plan view. A third wiring layer 5 is formed on the second back surface 2b, which is at least a part of the ground conductor layer. The second wiring layer 4 is electrically connected to the ground conductor layer via substrate penetration wiring 6 formed on the dielectric substrate 2.SELECTED DRAWING: Figure 1
Inventors:
TOJO YUJIRO
NUKAGA OSAMU
NUKAGA OSAMU
Application Number:
JP2021000155A
Publication Date:
July 14, 2022
Filing Date:
January 04, 2021
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
H05K1/02; H01P11/00; H05K3/00; H05K3/46
Attorney, Agent or Firm:
Sumio Tanai
Igarashi Mitsunaga
Toshio Komuro
Yuichiro Shimizu
Igarashi Mitsunaga
Toshio Komuro
Yuichiro Shimizu