Title:
HIGH FREQUENCY COMPONENT
Document Type and Number:
Japanese Patent JP2022122076
Kind Code:
A
Abstract:
To provide a high frequency component which can be manufactured in a high mass productivity.SOLUTION: A high frequency component 10 comprises: a dielectric member 1; a dielectric substrate 2; a first wiring layer 3; a third wiring layer (one part is a ground conductor layer) 5; a penetration distribution line; and an adhesive line 8. The first wiring layer 3 is formed on a second main surface 2a side of the dielectric substrate 2 or a first main surface 1a side of the dielectric member 1. An outer peripheral edge 1d of the dielectric member 1 is in an inner side from an outer peripheral edge 2e of the dielectric substrate 2 in a plan view. The high frequency component 10 further comprises: a first back surface 1b as a surface opposite to the first main surface 1a of the dielectric member 1; and a second wiring layer 4 contacted to a side surface 1c of the dielectric member 1. The second wiring layer 4 is electrically connected to at least one penetration distribution line and the third wiring layer (one part is the ground conductor layer) 5.SELECTED DRAWING: Figure 1
Inventors:
TOJO YUJIRO
XU LEI
NUKAGA OSAMU
XU LEI
NUKAGA OSAMU
Application Number:
JP2021019151A
Publication Date:
August 22, 2022
Filing Date:
February 09, 2021
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
H01P1/203; H01P11/00
Attorney, Agent or Firm:
Sumio Tanai
Igarashi Mitsunaga
Toshio Komuro
Yuichiro Shimizu
Igarashi Mitsunaga
Toshio Komuro
Yuichiro Shimizu