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Title:
HIGH FREQUENCY COMPOSITE COMPONENT
Document Type and Number:
Japanese Patent JP2003347963
Kind Code:
A
Abstract:

To provide a high frequency composite component used for a high frequency band such as a microwave and formed of a single module comprising a diplexer and a surface acoustic wave (SAW) duplexer in a front end portion for processing a high frequency signal between a transmitting/receiving unit and an antenna of a high frequency circuit of a dual band mobile communication terminal thereby improving characteristics such as reducing insertion loss and satisfying the miniaturization of the mobile communication terminal.

The diplexer 21 is formed of a conductive pattern on pattern dielectric sheets of a laminated structure, the SAW duplexer 22 includes two SAW filters mounted on a cavity of the laminated structure and a phase shifting device formed as a conductive pattern on a dielectric sheet of the laminated structure.


Inventors:
LEE CHANG-YONG
SHIN YU SEON
LEE JONG IK
Application Number:
JP2003111372A
Publication Date:
December 05, 2003
Filing Date:
April 16, 2003
Export Citation:
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Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H03H7/075; H01P1/213; H03H7/46; H04B1/3822; H04B1/50; (IPC1-7): H04B1/50; H03H7/075; H03H7/46
Attorney, Agent or Firm:
Hidekazu Miyoshi (1 outside)