To provide a high-frequency module apparatus which can be reduced in its weight and size, and has achieved high shielding effectiveness and high reliability.
A high-frequency circuit substrate 2 in which an opening 11 exposing a mounting surface of a module case 1 made of a metal is mounted on the module case 1. Each of a leg 12 and a wall 13 is contacted with the high-frequency wave circuit substrate 2 to arrange a conductive resin shielding member 4. The conductive resin shielding member 4 is fixed to the module case 1 by a shield fixing means 6 configured to be higher than the conductive resin shielding member 4. A power source circuit substrate 7 is fixed to the shield fixing means 6. The power source circuit substrate 7 and the high-frequency circuit substrate 2 are connected by a wiring 17 for power source via a through hole 16 provided in the conductive resin shielding member 4. The module case 1 for externally protecting the power source circuit substrate 7 to which the wiring 17 for power source is connected is provided so as to surround the power source circuit substrate 7.
KIRIKOSHI YU
KOHAMA MASAHIKO
| JPS5961998A | 1984-04-09 | |||
| JP2001211663A | 2001-08-03 | |||
| JP2006041037A | 2006-02-09 | |||
| JPS63159940A | 1988-07-02 |
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka
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