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Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE USING SAME
Document Type and Number:
Japanese Patent JP2009038807
Kind Code:
A
Abstract:

To provide a small-sized high-frequency module where an antenna switch circuit, a low pass filter, a coupler circuit and high-frequency amplifier circuit are integrally moduled in a multilayer substrate by primarily redesigning the layout configuration of electrode patterns of a coupler circuit.

In the high-frequency module where the antenna switch circuit, the low pass filter circuit, the coupler circuit and high-frequency amplifier circuit are module integrated by using a circuit element comprised of the electrode patterns in a multilayer substrate formed by laminating a plurality of dielectric layers and by the circuit element mounted on the multilayer substrate, a main channel and subchannel of the coupler circuit are comprised of the electrode patterns in the multilayer substrate. The electrode patterns for the main channel and subchannel are disposed not only in different dielectric layers in the multilayer substrate but also in upper and lower laminating directions separately.


Inventors:
FUKAMACHI KEISUKE
YAMASHITA TAKAHIRO
Application Number:
JP2008224194A
Publication Date:
February 19, 2009
Filing Date:
September 02, 2008
Export Citation:
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Assignee:
HITACHI METALS LTD
International Classes:
H01P1/15; H01P5/18; H04B1/3822; H04B1/40
Domestic Patent References:
JP2003008470A2003-01-10
JP2001086022A2001-03-30
JP2003046358A2003-02-14