Title:
HIGH FREQUENCY MODULE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2007096519
Kind Code:
A
Abstract:
To provide a small-sized high frequency module that can be conveyed by suction while maintaining hermetic sealing of a surface acoustic wave element.
The surface acoustic wave element 1 is mounted on the surface of a module board 10 and sealed with a thermosetting resin 2, legs 31 of a resin case 3 comprising the legs 31 and a ceiling plate 32 are fixed to the surface of the module board 10, so as to cover the surface of the module board 10 by the resin case 3, and the high frequency module is characterized in that the sealing of the surface acoustic wave element 1 and the fixation of the legs 31 to the module board 10 are carried out by one and the same thermosetting resin 2.
More Like This:
| JP2019041212 | ACOUSTIC WAVE DEVICE |
| JP3915649 | SURFACE MOUNTED SAW DEVICE AND ITS MANUFACTURING METHOD |
Inventors:
KITAZAWA KENJI
Application Number:
JP2005280631A
Publication Date:
April 12, 2007
Filing Date:
September 27, 2005
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H03H9/25; H01L23/08; H03H3/08