To provide a high-frequency module enabling a reduction in size while retaining a high airtightness of a device chip, and to provide a method of manufacturing the same.

The method of manufacturing the high-frequency module include the steps of: mounting the device chip 20 on an electrode pad 18 formed on a top surface of a substrate 10 made of an insulator using a bump 22 in a flip-chip manner; mounting a chip component 30 on the substrate 10; and sealing only the device chip 20 out of the chip component 30 and the device chip 20 with a sealing solder 24 so that a lid 26 covers the top surface of the device chip 20 and the top surface of the sealing solder 24.