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Title:
HIGH FREQUENCY MODULE, AND PRINTED CIRCUIT BOARD WITH HIGH FREQUENCY MODULE MOUNTED THEREON
Document Type and Number:
Japanese Patent JP2011035058
Kind Code:
A
Abstract:

To provide a high frequency module that is miniaturized and lowered in a height.

The high frequency module 100 includes a module substrate 10 in which external connection terminals 11 including ground terminals 12 are formed on the lower surface thereof, a plurality of electronic components 20 mounted on the upper surface of the module substrate 10, a sealing member 30 constituted of an insulating resin and formed on the upper surface of the module substrate 10 so as to seal the electronic components 20, and a shield case 40 disposed above the electronic components 20. The shield case 40 includes a top plate 41 and suspension parts 43 extending downward from the top plate 41, and the distal end parts of the suspension parts 43 are positioned in the vicinity of the ground terminals 12.


Inventors:
TOKUNO SHINICHI
YAMAMOTO SEIICHI
KUSHINO MASAHIKO
MURAKAMI MASAHIRO
Application Number:
JP2009177977A
Publication Date:
February 17, 2011
Filing Date:
July 30, 2009
Export Citation:
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Assignee:
SHARP KK
International Classes:
H01L23/00; H01L23/12; H01L23/29; H01L23/31
Domestic Patent References:
JP2008147572A2008-06-26
JP2007294828A2007-11-08
JP2005101365A2005-04-14
JP2006253278A2006-09-21
JP2004128334A2004-04-22
JP2005093752A2005-04-07
Foreign References:
WO2008093414A12008-08-07
Attorney, Agent or Firm:
Shizuo Sano
Inoue On



 
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