Title:
高周波モジュール
Document Type and Number:
Japanese Patent JP4394147
Kind Code:
B2
Abstract:
To provide a high-frequency module having an antenna configured by integrally connecting a slot plate laid out with radiation slots to a plate having plural thin plates formed with a waveguide for supplying power to the slot plate, using a diffusion bonding. The waveguide of the antenna is connected to a dielectric waveguide of a high-frequency package via a waveguide provided on a resin substrate, thereby configuring a slot antenna at low cost, and connecting a power-supply slot of the slot antenna to a waveguide terminal of the high-frequency package with low loss.
Inventors:
Koichi Matsuo
Inami Kazuki
Mamoru Yoshida
Takeshi Sueda
Shigeo Udagawa
Susumu Sato
Tsutomu Tamaki
Takuya Suzuki
Kosuke Yasooka
Minoru Hashimoto
Inami Kazuki
Mamoru Yoshida
Takeshi Sueda
Shigeo Udagawa
Susumu Sato
Tsutomu Tamaki
Takuya Suzuki
Kosuke Yasooka
Minoru Hashimoto
Application Number:
JP2007557803A
Publication Date:
January 06, 2010
Filing Date:
February 01, 2007
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01Q23/00; H01P5/107; H01P11/00; H01Q13/10
Domestic Patent References:
| JP11344537A | ||||
| JP2004088504A | ||||
| JP3531609B2 | ||||
| JP5235618A | ||||
| JP2005217865A | ||||
| JP62210704A | ||||
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Foreign References:
| US6727860 |
Attorney, Agent or Firm:
Hiroaki Sakai