Title:
High frequency module
Document Type and Number:
Japanese Patent JP6278117
Kind Code:
B2
Abstract:
An inductor component is disposed outside a multilayer substrate, and thus a directional coupler defined by an internal wiring electrode and a coil electrode within the inductor component that is mounted on a pair of land electrodes, the multilayer substrate significantly reduces or prevents interference with other high-frequency circuit elements disposed in or on the multilayer substrate. Additionally, if a plurality of inductor components having different inductor characteristics are prepared, a high-frequency module including the multilayer substrate capable of defining the directional coupler whose characteristics are able to adjusted with ease is able to be provided simply by selecting the desired inductor component from the inductor components and replacing that inductor component.
Inventors:
Kunitoshi Hanaoka
Application Number:
JP2016532979A
Publication Date:
February 14, 2018
Filing Date:
July 10, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01P5/18
Domestic Patent References:
| JP2012244324A | ||||
| JP2006191221A | ||||
| JP8505750A | ||||
| JP2000165116A |
Attorney, Agent or Firm:
Ryose Uji
Kakusho Shoichi
Maruyama Yosuke
Kakusho Shoichi
Maruyama Yosuke
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