Title:
HIGH-FREQUENCY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSORPTION METHOD
Document Type and Number:
Japanese Patent JP2023054542
Kind Code:
A
Abstract:
To provide a high-frequency package, a high-frequency module, and a radio wave absorption method, capable of improving radio wave absorption characteristics by making it possible to adjust a distance from a high-frequency component to a radio wave absorber.SOLUTION: A high-frequency package includes: a radio wave shielding portion that shields radio waves radiated from a high-frequency component; a radio wave absorber that is arranged facing the high-frequency component and absorbs the radio waves; and adjusting means that enables adjustment of a distance from the radio wave absorber to the high-frequency component by adjusting a position of the radio wave absorber with respect to the radio wave shielding portion.SELECTED DRAWING: Figure 1
Inventors:
YOSHIMURA YUKI
Application Number:
JP2021163459A
Publication Date:
April 14, 2023
Filing Date:
October 04, 2021
Export Citation:
Assignee:
NEC CORP
International Classes:
H05K9/00; H01Q17/00
Attorney, Agent or Firm:
Sumio Tanai
Ryuichiro Mori
Yasushi Matsunuma
Eisuke Ito
Ryuichiro Mori
Yasushi Matsunuma
Eisuke Ito
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