HIGH-FREQUENCY PROBE

Japanese Patent JP3190866

B2

PROBLEM TO BE SOLVED: To obtain a high-frequency probe by which a measurement can be performed with good reproducibility, by a method wherein grounding plates are arranged in parallel on both sides near a tip of a center conductor, the tip of the center conductor comes into contact with an object to be measured, so as not to be deflected by means of the scissor spring structure of the grounding plates and the tip comes into pressure contact with a device stage.
SOLUTION: When a measurement is performed by a high-frequency probe, a center conductor 100 is brought into contact with the signal electrode of an object 2000 to be measured, and grounding plates 120 are pressed down until they hit a device stage 1100 which comes into contact with the rear as the grounding electrode of the object 2000 to be measured. At this time, a conical transmission line which is composed of the conductor 100 and of a cylindrical grounding conductor 110 is bent to the vertical direction. A distributed constant circuit in which the state 1100 is used as the reference of a ground and in which an impedance is matched up to the tip of the probe is formed, and a good high-frequency characteristic is obtained. In addition, a spring characteristic is obtained by the branch part of the grounding plates 120, the ground can be connected to the object 2000 to be measured, the distance between the stage 1100 and the grounding plates 120 can be made shortest, and a measurement can be performed with good reproducibility.

Koji Matsunaga
Hirofumi Inoue
Masao Tanebashi
Toru Taura
Yuichi Yamagishi
Satoshi Hayakawa
Hironori Tsugane

JP32125197A

July 23, 2001

November 21, 1997

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NEC
Anritsu Corporation

G01R31/26; G01R1/06; G01R1/067; (IPC1-7): G01R1/06; G01R1/067; G01R31/26

JP8233861A
JP580077A

Nobuyuki Kaneda (2 others)

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