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Patent Searching and Data


Title:
HIGH FREQUENCY SEALING MATERIAL
Document Type and Number:
Japanese Patent JP2011057723
Kind Code:
A
Abstract:

To provide a high frequency sealing material which can be sealed by the application of high frequency voltage, maintains the rigidity and heat resistance of polypropylene, is transparent, is excellent in sealability at a good sealing rate and in low energy, and gives a high sealing strength.

The high frequency sealing material comprises (A) random polypropylene having a melting point of ≤140°C and (B) an ionomer prepared by neutralizing a part or all of the carboxyl groups of a random copolymer produced by at least copolymerizing ethylene with an unsaturated carboxylic acid with potassium, or has a heat-generating layer comprising (B) the ionomer and (C) polypropylene, and a heat-melting layer comprising (A) the random polypropylene, disposed on at least one side of the heat-generating layer and meltable with heat.


Inventors:
KIKUCHI HAYATO
NAKADA KAZUYUKI
Application Number:
JP2009205283A
Publication Date:
March 24, 2011
Filing Date:
September 04, 2009
Export Citation:
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Assignee:
MITSUI DU PONT POLYCHEMICAL
International Classes:
C08L23/14; C08L23/26; C09K3/10
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda